Method and apparatus for predicting board deformation, and...

Data processing: measuring – calibrating – or testing – Measurement system – Performance or efficiency evaluation

Reexamination Certificate

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Details

C702S136000, C702S035000, C716S030000

Reexamination Certificate

active

07139678

ABSTRACT:
An apparatus for predicting a deformation of a board includes a board dividing unit that divides the board into a plurality of areas based on wiring information on the board; and a deformation predicting unit that grasps a wiring pattern of an area macroscopically, calculates an equivalent physical property value equivalent to a modulus of longitudinal elasticity and a coefficient of thermal expansion by a finite element method, and predicts the deformation of the board based on the equivalent physical property value calculated for each of the areas divided by the board dividing unit.

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Chao-Pin Yeh et al., “Correlation of analytical and experimental to determine thermally induced PWB warpage”, Dec. 1993, IEEE, IEEE Transactions on Components, Hybrids, and Manufacturing Technology, vol. 16, issue 8, pp. 986-995.
Djurovic et al., “Analysis of thermal warpage in a PCB with an array of PTH connectors”, Sep. 1999, IEEE, IEEE Transactions on Components and Packaging Technologies, vol. 22, issue 3, pp. 414-420.

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