Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Reexamination Certificate
2005-10-03
2009-11-17
Loke, Steven (Department: 2818)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Chip mounted on chip
C257S782000, C257S797000, C257SE23010, C257S685000, C257S024000, C257SE21499, C257SE21511, C438S462000, C438S108000, C438S015000, C438S026000, C438S051000, C438S055000, C438S064000, C438S106000, C438S124000, C438S126000, C438S127000
Reexamination Certificate
active
07619312
ABSTRACT:
A system that facilitates precise inter-chip alignment. The system includes a first integrated circuit chip, whose surface has etch pit wells. The system also includes a second integrated circuit chip, whose surface has corresponding etch pit wells that mate with the etch pit wells of the first integrated circuit chip. Spherical balls are placed in the etch pit wells of the first integrated circuit chip such that when the corresponding etch pit wells of the second integrated circuit chip are substantially aligned with the spherical balls, the spherical balls mate with the etch well pits of the second integrated circuit chip, thereby precisely aligning the first integrated circuit chip with the second integrated circuit chip.
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Cunningham John E.
Follmer Edward Lee
Krishnamoorthy Ashok V.
Khosraviani Arman
Loke Steven
Park Vaughan & Fleming LLP
Sun Microsystems Inc.
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