Chemistry: electrical and wave energy – Apparatus – Electrolytic
Reexamination Certificate
2007-05-01
2007-05-01
King, Roy (Department: 1742)
Chemistry: electrical and wave energy
Apparatus
Electrolytic
C204S242000, C204S279000, C204S286100, C204S229100, C204S229800, C204S230100, C204S22400M, C204S22400M, C205S083000, C205S123000, C205S640000, C205S641000, C205S643000, C205S644000
Reexamination Certificate
active
10365577
ABSTRACT:
Controlled-potential electroplating provides an effective method of electroplating metals onto the surfaces of high aspect ratio recessed features of integrated circuit devices. Methods are provided to mitigate corrosion of a metal seed layer on recessed features due to contact of the seed layer with an electrolyte solution. The potential can also be controlled to provide conformal plating over the seed layer and bottom-up filling of the recessed features. For each of these processes, a constant cathodic voltage, pulsed cathodic voltage, or ramped cathodic voltage can be used. An apparatus for controlled-potential electroplating includes a reference electrode placed near the surface to be plated and at least one cathode sense lead to measure the potential at points on the circumference of the integrated circuit structure.
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Contolini Robert
Mayer Steven T.
Reid Jonathan
King Roy
Novellus Systems Inc.
Parsons Hsue & de Runtz LLP
Zheng Lois
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