Method and apparatus for post-CMP cleaning of a...

Details Method and apparatus for post-CMP cleaning of a... Method and apparatus for post-CMP cleaning of a...

2007-03-27

2007-03-27

Ackun, Jr., Jacob K. (Department: 3723)

Abrading

Machine

Rotary tool

Reexamination Certificate

active

11363640

ABSTRACT:
A method and apparatus are provided for post-CMP cleaning of a semiconductor work piece. The method comprises the steps of subjecting the work piece to a first cleaning composition having one of an acidic pH and a basic pH and subjecting the work piece to a second cleaning composition having an acidic pH, if the first cleaning composition has a basic pH and subjecting the work piece to a second cleaning composition having a basic pH, if the first cleaning composition has an acidic pH.

REFERENCES:
patent: 5078801 (1992-01-01), Malik
patent: 6006765 (1999-12-01), Skrovan et al.
patent: 6368183 (2002-04-01), Trojan et al.
patent: 6586336 (2003-07-01), Jeong
patent: 6727187 (2004-04-01), Takeshima et al.
patent: 6852007 (2005-02-01), Gonzalez-Martin et al.
patent: 2001/0039116 (2001-11-01), Takeshima et al.
patent: 2002/0107155 (2002-08-01), Miller et al.

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