Method and apparatus for positioning layers within a layered...

Details Method and apparatus for positioning layers within a layered... Method and apparatus for positioning layers within a layered...

2010-08-25

2011-12-06

Nguyen, Khanh P (Department: 1746)

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

C156S166000, C156S169000, C156S172000, C156S184000, C156S185000

Reexamination Certificate

active

08070899

ABSTRACT:
A method of positioning a tape preform as a layer onto a resistive device substrate during the manufacture of a layered resistive device is provided. The method includes locating the tape preform in a predetermined position and translating one or more of the following relative to each other until a portion of the positioning device engages the tape preform: a positioning device, the resistive device substrate, and the tape preform. The method also includes continuing the translation until the tape preform engages the resistive device substrate and continuing the translation such that components of the positioning device progressively translate around the resistive device substrate and subsequently position the tape preform onto the resistive device substrate. In some forms, the method includes using a controller and/or applying a predetermined cycle of temperature, pressure, and time to the substrate and tape preform.

REFERENCES:
patent: 614689 (1898-11-01), Beauregard
patent: 2597431 (1952-05-01), Beck
patent: 3188716 (1965-06-01), McGraw, Jr.
patent: 3648218 (1972-03-01), Kellerman
patent: 3687782 (1972-08-01), Comte
patent: 3806098 (1974-04-01), Clough
patent: 3845443 (1974-10-01), Fisher
patent: 3880609 (1975-04-01), Caddock
patent: 4028657 (1977-06-01), Reichelt
patent: 4072921 (1978-02-01), Sacchetti
patent: 4980014 (1990-12-01), DiFrank et al.
patent: 5729814 (1998-03-01), Suzuki et al.
patent: 5973296 (1999-10-01), Juliana et al.
patent: 6652906 (2003-11-01), Pinarbasi
patent: 6712110 (2004-03-01), Nelson et al.
patent: 7196295 (2007-03-01), Fennewald et al.
patent: 2002/0195444 (2002-12-01), Lin et al.
patent: 2005/0145617 (2005-07-01), McMillin et al.
patent: 2006/0054616 (2006-03-01), Ptasienski
patent: 2009/0020905 (2009-01-01), Privett
patent: 2009/0021342 (2009-01-01), Brummell et al.
patent: 2018113 (1991-02-01), None
patent: 720416 (1996-07-01), None
patent: 1055978 (2000-11-01), None
patent: 1132794 (1968-11-01), None
patent: 2068173 (1981-08-01), None
patent: 2316848 (1998-03-01), None
patent: 2338632 (1999-12-01), None
patent: 57178877 (1982-11-01), None
patent: 62013285 (1987-01-01), None
patent: 2000249584 (2000-09-01), None
patent: WO 98/03038 (1998-01-01), None
patent: WO 00/08527 (2000-02-01), None
patent: WO 01/11924 (2001-02-01), None
patent: WO 01/98054 (2001-12-01), None
International Search Report and Written Opinion—PCT/US2008/070296.
International Search Report and Written Opinion—PCT/US2008/070014.
International Search Report and Written Opinion—PCT/US2009/039250.
Thick Film Heaters Made from Dielectric Tape Bonded Stainless Steel Substrates, S.J. Stein, R. Wahlers, M. Heinz, M.A. Stein—Electro Science Laboratories Inc. (USA); R. Tait, R. Humphries—Agmet Ltd. (UK), Presented at IMAPS, 1995.

Affiliated with

Also associated with

Rating

Method and apparatus for positioning layers within a layered... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and apparatus for positioning layers within a layered..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for positioning layers within a layered... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4310211