Method and apparatus for positioning layers within a layered...

Adhesive bonding and miscellaneous chemical manufacture – Surface bonding means and/or assembly means therefor – With bending – folding – winding – or wrapping means

Reexamination Certificate

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C156S184000, C156S185000, C156S187000, C156S443000, C156S475000, C156S486000, C156S492000

Reexamination Certificate

active

08061402

ABSTRACT:
An apparatus for positioning a tape preform as a layer onto a substrate during the manufacture of a layered resistive device is provided. The apparatus includes at least one positioning member, wherein the positioning member defines a proximal end portion and a distal end portion. The apparatus also includes a contact member adapted to engage the tape preform against the substrate. The contact member and the distal end portion of the positioning member are configured to position the tape preform onto the substrate.

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