Method and apparatus for positioning components

Material or article handling – Apparatus for moving intersupporting articles into – within,... – Unstacking apparatus

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Details

4147957, 29740, 29834, 221211, 221238, 221287, B65G 5906, B23P 1900

Patent

active

050448757

ABSTRACT:
A method and apparatus are provided for simultaneously positioning electronic components, such as surface-mounted chips on a circuit board. A removable load plate carries a plurality of chip placement assemblies, each having a support disposing a plurality of such components in a stack adjacent the board. The assemblies are disposed about the load plate in a geometric pattern corresponding to that of chips to be placed. A stripping component of each assembly in slidable engagement with the support sequentially urges each chip in the stack transversely from the stack to a second position opposing a corresponding desired site on the board where the chip is to be placed. Each support includes a mounting block having a connector for releasable interconnection of each positioning apparatus to the load plate. A chamber maintains the chip at the second position in response to fluid pressure differential. The support receives a tube for transporting the chip from the second position to a third position wherein it engages the board site. A shuttle plate simultaneously urges the stripping components of all assemblies in the slidable motion to strip chips from the stack. The load plate is easily replaced with one re-loaded off line to carry a replenished supply of chips in the same or different pattern.

REFERENCES:
patent: 4046370 (1977-09-01), Navi
patent: 4222166 (1980-09-01), Kurek et al.
patent: 4389272 (1983-06-01), Ferri et al.
patent: 4393579 (1983-07-01), Van Hooreweder
patent: 4543713 (1985-10-01), Rapp
patent: 4740136 (1988-04-01), Asai et al.

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