Method and apparatus for positioning an integrated circuit devic

Details Method and apparatus for positioning an integrated circuit devic Method and apparatus for positioning an integrated circuit devic

1992-09-16

1994-12-27

Nguyen, Vinh

Electricity: measuring and testing

Measuring, testing, or sensing electricity, per se

With rotor

G01R 3128

Patent

active

053768825

ABSTRACT:
A method and an apparatus are disclosed for positioning an integrated circuit chip to be tested on a device-under-test ("DUT") interface board without using a hold-down plate and for attaching this interface board to a feed-through interface module so that the device being tested makes abutting contact with the feed-through interface module and so that the contact pins of the device being tested make abutting electrical contact with contact pin sockets on the DUT interface board. This arrangement provides a path for heat and ion dissipation from the chip being tested in a simple and elegant manner which also minimizes potential damage to the chip.

REFERENCES:
patent: 3654585 (1972-04-01), Wickersham
patent: 4506938 (1985-03-01), Madden
patent: 4560216 (1985-12-01), Egawa
patent: 4899107 (1990-02-01), Corbett et al.
patent: 4940935 (1990-07-01), Riley
"Flexible Vacuum Adjustable Load Module", p. 23, published by Flexible Interface, 1992.
"Heating and Cooling", p. 49, published by Flexible Interface, 1992.

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