Method and apparatus for polishing workpiece

Details Method and apparatus for polishing workpiece Method and apparatus for polishing workpiece

2006-03-14

2006-03-14

Rachuba, M. (Department: 3723)

Abrading

Abrading process

Glass or stone abrading

C451S287000, C451S288000, C451S057000, C451S066000, C451S067000

Reexamination Certificate

active

07011569

ABSTRACT:
A workpiece such as a semiconductor wafer is polished by pressing the workpiece against a polishing surface under a predetermined pressure. A polished surface of the workpiece is processed by pressing the workpiece against a processing surface under a predetermined pressure while the processing surface makes circulatory translational motion along a predetermined path. The processing surface comprises a surface of a polishing cloth or a surface of an abrading plate, and the polished surface of the workpiece is further polished or cleaned.

REFERENCES:
patent: 5616063 (1997-04-01), Okumura et al.
patent: 5679059 (1997-10-01), Nishi et al.
patent: 5718618 (1998-02-01), Guckel et al.
patent: 5738574 (1998-04-01), Tolles et al.
patent: 5827110 (1998-10-01), Yajima et al.
patent: 5830045 (1998-11-01), Togawa et al.
patent: 5885138 (1999-03-01), Okumura et al.
patent: 5897426 (1999-04-01), Somekh
patent: 5989107 (1999-11-01), Shimizu et al.
patent: 6180020 (2001-01-01), Moriyama et al.
patent: 6283822 (2001-09-01), Togawa et al.
patent: 6343978 (2002-02-01), Shimizu et al.
patent: 6413156 (2002-07-01), Shimizu et al.
patent: 0517594 (1992-12-01), None
patent: 0684634 (1995-11-01), None
patent: 0 761 387 (1997-03-01), None
patent: 0 807 492 (1997-11-01), None
patent: 0874390 (1998-10-01), None
patent: 4-69147 (1992-03-01), None
patent: 5-285807 (1993-11-01), None
patent: 8-64562 (1996-03-01), None
patent: 9-232257 (1997-09-01), None
patent: 10-256201 (1998-09-01), None
patent: 82/03038 (1982-09-01), None
patent: 99/26761 (1999-06-01), None
Kaitoh Tei et al., “Planarization of Device Wafer with Fixed Abrasive Particles (Second Report)”—Planarization Working Characteristics with Fine Silica Grindstone—, from the Japan Society for Precision Engineering.
WO Mar. 1997 PCT.

Affiliated with

Also associated with

Rating

Method and apparatus for polishing workpiece does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and apparatus for polishing workpiece, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for polishing workpiece will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3532090