Method and apparatus for polishing workpiece

Abrading – Abrading process – Glass or stone abrading

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Details

451285, 451287, 451288, 451398, B24B 700

Patent

active

056517246

ABSTRACT:
A predetermined amount of liquid such as water is supplied to a backside surface of a workpiece such as a semiconductor wafer. Such liquid is a workpiece retaining liquid and is attached to a concave workpiece holding surface of a top ring. The workpiece is positioned between a turntable and the top ring and is polished by an abrasive cloth on the turntable while the workpiece is being pressed against the turntable by the top ring. While polishing, the workpiece is deformed toward the concave workpiece holding surface of the top ring, and a curvature of the deformed workpiece is controlled by the amount of liquid between the workpiece holding surface and the backside surface of the workpiece.

REFERENCES:
patent: 4313284 (1982-02-01), Walsh
patent: 4899768 (1990-02-01), Yatabe
patent: 4918869 (1990-04-01), Kitta
patent: 5081795 (1992-01-01), Tanaka et al.
patent: 5441444 (1995-08-01), Nakajima
patent: 5449316 (1995-09-01), Strasbaugh

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