Method and apparatus for polishing wafer

Details Method and apparatus for polishing wafer Method and apparatus for polishing wafer

1996-12-02

1998-05-12

Morgan, Eileen P.

Abrading

Abrading process

With critical temperature modification or control of work or...

451 41, 451 56, 451287, B24B 5300

Patent

active

057497729

ABSTRACT:
A polishing pad is conditioned using a conditioning disc whose temperature is controlled upon Chemical Mechanical Polish. The temperature of the polishing pad remains unchanged upon conditioning and uniform CMP can be carried out.

REFERENCES:
patent: 5081051 (1992-01-01), Mattingly et al.
patent: 5291693 (1994-03-01), Nguyen
patent: 5456627 (1995-10-01), Jackson et al.
patent: 5643067 (1997-07-01), Katsuoka et al.
patent: 5645682 (1997-07-01), Skrovan

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