Method and apparatus for polishing semiconductor substrate

Details Method and apparatus for polishing semiconductor substrate Method and apparatus for polishing semiconductor substrate

1996-08-26

1999-02-02

Gupta, Yogendra N.

Semiconductor device manufacturing: process

Chemical etching

Combined with the removal of material by nonchemical means

438747, 438748, 451278, H01L 21304

Patent

active

058664807

ABSTRACT:
A polishing pad is adhered to the top surface of a flat polishing pad holder of a platen. A substrate holding head for holding and rotating a semiconductor substrate is provided above the platen. The semiconductor substrate is rotated and pressed against the polishing pad on the platen. A slurry is supplied in a prescribed amount from a slurry supply pipe onto the polishing pad. A slat-like slurry pushing member for pushing the slurry to a central portion of the platen is provided slidably over the polishing pad. The slurry pushing member is fixed so that an inner portion thereof in a radial direction of the platen is downstream of an outer portion thereof in the radial direction of the platen in the direction of rotation of the platen during polishing.

REFERENCES:
patent: 4910155 (1990-03-01), Cote et al.
patent: 5081051 (1992-01-01), Mattingly et al.
patent: 5216843 (1993-06-01), Breivolgel et al.
patent: 5308438 (1994-05-01), Cote et al.
patent: 5341602 (1994-08-01), Foley
patent: 5527424 (1996-06-01), Mullins

Affiliated with

Also associated with

Rating

Method and apparatus for polishing semiconductor substrate does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and apparatus for polishing semiconductor substrate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for polishing semiconductor substrate will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1117086