Method and apparatus for polishing semiconductor substrate

Details Method and apparatus for polishing semiconductor substrate Method and apparatus for polishing semiconductor substrate

1997-04-04

1999-12-07

Scherbel, David A.

Abrading

Abrading process

With tool treating or forming

451 45, 451443, 451288, B24B 100

Patent

active

059973854

ABSTRACT:
An elastic polishing pad is adhered to a surface of a flat substrate holder of a platen. A substrate holding head which holds and rotates a semiconductor substrate is provided above a first region extending from the central portion to peripheral portion of the polishing pad. The semiconductor substrate rotated by the substrate holding head is pressed against the first region of the polishing pad. A slurry is dropped in a prescribed amount from an abrasive supply pipe onto the polishing pad. Pad pressing means for pressing the polishing pad is provided above a second region extending from the central portion to peripheral portion of the platen. The pad pressing means has a disk-shaped pad pressing plate and a rotary shaft for holding the pad pressing plate.

REFERENCES:
patent: 5486131 (1996-01-01), Cesna et al.
patent: 5547417 (1996-08-01), Breivogel et al.

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