Method and apparatus for polishing metal surfaces

Details Method and apparatus for polishing metal surfaces Method and apparatus for polishing metal surfaces

1996-08-28

1998-06-02

Kight, John

Etching a substrate: processes

Nongaseous phase etching of substrate

Relative movement between the substrate and a confined pool...

216 92, 216105, 216106, 438691, 438748, 156345, C23F 102, C23F 144, C23F 108, H05K 306

Patent

active

057594279

ABSTRACT:
A technique for chemically planarizing an exposed surface of metal on a substrate to a pre-determined thickness is provided. The substrate has an exposed metal surface such as copper circuitry on a dielectric substrate which is to be planarized. Typically, this will be circuitization extending above a photoresist layer. A planarizing head is rotated against the substrate, with the planarizing head in contact with the metal surface on the substrate. A chemical etchant, essentially free of abrasive material, is continuously supplied to the interface between the metal surface and the planarizing head. The planarizing continues until a predetermined thickness of the metal has been reached. In circuit board manufacturing, this will form a surface co-planar with the photoresist. In some instances where significant height reduction is required, thus requiring significant metal removal, several passes of the substrate may be required or a device with multiple heads may be used. On all but the last pass or last head, the planarizing head may include a film of polyester impregnated with very fine grit, such as 15.mu. or less silicon carbide (SiC). However, on the final pass or head, a relatively hard surface roll, e.g., rubber, free of added grit, is used to ensure a planar surface free of gouges.

REFERENCES:
patent: 4250588 (1981-02-01), Cook et al.
patent: 4269138 (1981-05-01), Dinella et al.
patent: 4438795 (1984-03-01), Plough
patent: 4944836 (1990-07-01), Beyer et al.
patent: 4964365 (1990-10-01), D'Amato
patent: 5128010 (1992-07-01), Ye
patent: 5232501 (1993-08-01), Pender et al.
patent: 5312887 (1994-05-01), Papathomas
patent: 5335681 (1994-08-01), Schmid
patent: 5348615 (1994-09-01), Gupta
patent: 5399528 (1995-03-01), Leibovitz et al.
"Planarization of Films Used in IC Fabrication by Laser-Induced Chemical Etching," C.J. Hendricks, IBM Technical Disclosure Bulletin, vol. 26, No. 10B, Mar. 1984.

Affiliated with

Also associated with

Rating

Method and apparatus for polishing metal surfaces does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and apparatus for polishing metal surfaces, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for polishing metal surfaces will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1455751