Method and apparatus for polishing chamfers of semiconductor waf

Details Method and apparatus for polishing chamfers of semiconductor waf Method and apparatus for polishing chamfers of semiconductor waf

1997-07-29

1999-11-23

Scherbel, David A.

Abrading

Abrading process

Glass or stone abrading

451 36, 451 42, 451 43, 451 57, 451 65, 451 67, B24B 4900

Patent

active

059891050

ABSTRACT:
A semiconductor wafer chamfer polishing method for polishing chamfers formed on the edges of semiconductor wafers includes rotating a semiconductor wafer; pressing a polishing cloth against a chamfer of the semiconductor wafer with sufficient pressure to elastically deform the polishing cloth, while supplying polishing fluid to the chamfer; sliding the polishing cloth along an incline of the chamfer from an outer edge toward a center of the semiconductor wafer so as to form a bulge portion of the polishing cloth which contacts an outer surface of the semiconductor wafer, thereby polishing the outer surface along with the chamfer of the semiconductor wafer.

REFERENCES:
patent: 5094037 (1992-03-01), Hakomori et al.
patent: 5316620 (1994-05-01), Hasegawa et al.
patent: 5317836 (1994-06-01), Hasegawa et al.
patent: 5404678 (1995-04-01), Hasegawa et al.
patent: 5547415 (1996-08-01), Hasegawa et al.
patent: 5830045 (1998-11-01), Togawa et al.

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