Abrading – Abrading process – Glass or stone abrading
Patent
1993-11-24
1995-03-21
Rachuba, Maurina T.
Abrading
Abrading process
Glass or stone abrading
451286, 451388, B24B 100
Patent
active
053984595
ABSTRACT:
A workpiece such as a semiconductor wafer is positioned between a turntable and a top ring and polished by an abrasive cloth on the turntable while the top ring is being pressed against the turntable. The top ring has a retaining ring for preventing the workpiece from deviating from the lower surface of the top ring, and the retaining ring has an inside diameter larger than an outside diameter of the workpiece. The rotation of the turntable imparts a pressing force in a direction parallel to the upper surface of the turntable to the workpiece so that an outer periphery of the workpiece contacts an inner periphery of the retaining ring, and the rotation of the retaining ring imparts a rotational force to the workpiece so that the workpiece performs a planetary motion relative to the top ring in the retaining ring.
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Patent Abstracts of Japan, vol. 10, No. 122 (M-476)(2179) May 7, 1986.
Bonora, "Flex-Mount Polishing of Silicon Wafers", Solid State Technology, Oct. 1977, pp. 55-62.
Aoki Riichirou
Hirose Masayoshi
Ikeda Yukio
Ishii You
Kimura Norio
Ebara Corporation
Kabushiki Kaisha Toshiba
Rachuba Maurina T.
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