Method and apparatus for polishing a semiconductor substrate waf

Details Method and apparatus for polishing a semiconductor substrate waf Method and apparatus for polishing a semiconductor substrate waf

1995-05-17

1997-09-09

Bowers, Jr., Charles L.

Semiconductor device manufacturing: process

Chemical etching

Combined with the removal of material by nonchemical means

156345, 451 41, 451283, 451285, 451287, 451288, 438693, H01L 21304

Patent

active

056656564

ABSTRACT:
A semiconductor wafer polishing apparatus includes a housing and a turntable mounted in the housing. The turntable has an axis of rotation and a surface for affixing a semiconductor wafer. The polishing apparatus also includes a motor mounted to the housing and connected to the turntable to supply a torque for rotating the turntable about the axis of rotation. A polishing assembly is connected to the housing and extends adjacent to the turntable surface. A polishing pad is affixed to the polishing assembly and is positionable to contact the semiconductor wafer. Some polishing pads are cylindrical in form. Other polishing pads have a conical form.

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