Method and apparatus for plating under constant current density

Details Method and apparatus for plating under constant current density Method and apparatus for plating under constant current density

1977-03-29

1977-12-27

Mack, John H.

Chemistry: electrical and wave energy

Apparatus

Electrolytic

204231, 204DIG7, C25B 1502, C25D 2112

Patent

active

040653749

ABSTRACT:
In the present plating apparatus the bath contains an electrolyte solution having a uniform ion concentration. A common electrode, a plating electrode and a standard electrode are arranged in the bath. A direct current source is connected between the common electrode and the plating electrode. A further, constant, direct current source is connected between the common electrode and the standard electrode. A potentiometer device is arranged for detecting resistance changes between these electrodes due to variations in the ion concentration and in the mobility of the electrolyte solution between the electrodes. A control is responsive to the potentiometer device for regulating the plating current supplied by the direct current source as a function of the potential difference detected by the potentiometer device, whereby a constant plating current density is achieved.

REFERENCES:
patent: 3573175 (1971-03-01), Bedi
patent: 3627648 (1971-12-01), Waggener
patent: 3875032 (1975-04-01), Thompson

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