Chemistry: electrical and wave energy – Processes and products
Patent
1989-06-14
1991-07-16
Tufariello, T. M.
Chemistry: electrical and wave energy
Processes and products
C25D 502
Patent
active
050322354
ABSTRACT:
Improved method and apparatus are disclosed for through hole plating of composite materials. The apparatus of the present invention comprises a plating cell which includes a baffle plate intermediate a plating anode and the material to be plated. The baffle plate acts to distribute the plating material within the plating fluid to provide a resultant plated material of uniform thickness and adhesion. The plating cell also includes a plating fluid supply system which is remote from the plating cell to thereby allow the characteristics of the plating solution to be monitored and controlled. The method which comprises the present invention includes the step of co-curing the composite material with a plating foil prior to plating the material to provide improved adhesion of the plating material to the composite material.
REFERENCES:
patent: 1739657 (1929-12-01), Shemitz
patent: 3071521 (1963-01-01), Ehrhart
patent: 3649509 (1972-03-01), Morawetz
patent: 3763027 (1973-10-01), Pearson
patent: 3839180 (1974-10-01), Takaysu
patent: 3840455 (1974-10-01), Cooley et al.
patent: 4010005 (1977-03-01), Morisaki et al.
patent: 4033844 (1977-07-01), Pantiga et al.
patent: 4132618 (1979-01-01), Boulanger et al.
patent: 4172771 (1979-10-01), Grunke
patent: 4279706 (1981-07-01), Blanc et al.
patent: 4280884 (1981-07-01), Babb et al.
patent: 4294680 (1981-10-01), Lincoln et al.
patent: 4298446 (1981-11-01), Ando et al.
patent: 4348267 (1982-09-01), Shimamura
patent: 4443304 (1984-04-01), Eidschun
patent: 4554062 (1985-11-01), Sergio
patent: 4560460 (1985-12-01), Blasing et al.
patent: 4572768 (1986-02-01), Wolski et al.
patent: 4619741 (1986-10-01), Minten
patent: 4750981 (1988-06-01), Dalland et al.
Banis David S.
Downing Ross O.
The Boeing Company
Tufariello T. M.
LandOfFree
Method and apparatus for plating through holes in graphite compo does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method and apparatus for plating through holes in graphite compo, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for plating through holes in graphite compo will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-129064