Chemistry: electrical and wave energy – Apparatus – Electrolytic
Patent
1975-10-17
1977-08-30
Tufariello, T. M.
Chemistry: electrical and wave energy
Apparatus
Electrolytic
204224R, C25D 1728, C25D 1722, C25D 502
Patent
active
040453219
ABSTRACT:
A method and apparatus for plating the posts of a semiconductor chip header is described. A means is provided for orientating the headers and feeding them in single file to a predetermined position in the apparatus. A transporting means is provided for transporting the headers from the feeding means over a plating bath such that the posts of the header are immersed in the bath. Attached to the transporting means is a plurality of clamping assemblies. Each of the clamping assemblies includes a knife-like member for electrically insulating the thru-leads of the header from its envelope lead and means for clamping the thru-leads of the header to the knife-like member. The clamping means of the clamping assemblies also include means for coupling a source of potential between the plating bath and the thru-leads clamped therein.
REFERENCES:
patent: 2749300 (1956-06-01), Thomas
patent: 3123543 (1964-03-01), Chapman, Jr. et al.
patent: 3409531 (1968-11-01), Ryerson et al.
patent: 3878062 (1975-04-01), Grimaldi
patent: 3897323 (1975-07-01), Schlotthauer
patent: 3951772 (1976-04-01), Bick et al.
Higgins Willis E.
National Semiconductor Corporation
Tufariello T. M.
Woodward Gail W.
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