Method and apparatus for plating substrate

Details Method and apparatus for plating substrate Method and apparatus for plating substrate

2007-05-15

2007-05-15

Wong, Edna (Department: 1753)

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Coating selected area

C205S123000, C205S143000, C205S184000, C205S205000

Reexamination Certificate

active

10624564

ABSTRACT:
After bubbles adsorbed to a substrate are removed by rotating the substrate in a plating solution at a higher speed or after the wettability of the surface of the substrate to be plated is improved before the substrate is immersed in the plating solution, the substrate is rotated in the plating solution at a lower speed so that a plating process is performed with respect to the substrate.

REFERENCES:
patent: 6001234 (1999-12-01), Batz et al.
patent: 6140744 (2000-10-01), Bran
patent: 6344129 (2002-02-01), Rodbell et al.
patent: 6551487 (2003-04-01), Reid et al.
patent: 6610189 (2003-08-01), Wang et al.
patent: 2002/0112964 (2002-08-01), Gandikota et al.
patent: 2001-049495 (2001-02-01), None
patent: 2001316869 (2001-11-01), None
patent: P2001-316869 (2001-11-01), None
patent: 2002-129385 (2002-05-01), None
Chinese Office Action Issued Dec. 22, 2006 for Corresponding Chinese Patent Application 200510070437.3.

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