Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Involving measuring – analyzing – or testing
Patent
1994-12-05
1997-02-25
Gorgos, Kathryn
Electrolysis: processes, compositions used therein, and methods
Electrolytic coating
Involving measuring, analyzing, or testing
205103, 205104, 205105, 205106, 205107, 205108, 204406, 204434, 204400, 204DIG9, 204228, C25D 2112, C25D 518, C25D 550, G01N 2726
Patent
active
056056150
ABSTRACT:
A method and apparatus for plating metals which delivers a voltage pulse with the possibility of a widely varying current magnitude characteristic to a plating electrode and an object having a large electrical reactance in terms of a parallel resistance and capacitance in order to raise the voltage potential between the electrode and an object to a programmed plating voltage overpotential and underpotential. The programmed plating voltage overpotential determines how fast the electrochemical reaction is allowed to proceed in the diffusion layer, and the programmed voltage underpotential determines how quickly the electrochemical reaction of the diffusion layer will slow down.
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J. Puippe et al., "Theory and Practice of Pulse Plating" published by American Electroplaters and Surface Finishers Society, 1986, pp. 1, 2, 5, 8, 23, 38, 43, 52, 53, and 124 no month.
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Jernstedt, "Better Deposits at Greater Speeds by PR Plating", pp. 1-6. Jul. 1948.
Goolsby Peter G.
Lai Lei P.
Ramirez Dan R.
Gorgos Kathryn
Jackson Miriam
Motorola Inc.
Wong Edna
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