Method and apparatus for plated EMI housing with integrated posi

Details Method and apparatus for plated EMI housing with integrated posi Method and apparatus for plated EMI housing with integrated posi

1997-09-22

2000-10-31

Reichard, Dean A.

Electricity: conductors and insulators

Anti-inductive structures

Conductor transposition

250214VT, H05K 900

Patent

active

061405744

ABSTRACT:
A monlithic housing assembly for an electronic device for providing electromagnetic interference (EMI) protection and positive and negative contact areas. The housing includes a hollow substantially cylindrical tube of uniform diameter for receiving the electronic device. The tube includes a first cylindrical outer surface comprising a first conductively plated portion defining a negative contact area and a second machined portion defining a positive contact area. The tube further includes a plurality of slot holes in the second machined portion which extend into the first conductively plated portion for receiving capacitive elements to provide EMI protection for the electronic device. First and second bore holes are located in respective first conductively plated portion and positive contact area for receiving corresponding negative and positive voltage terminals from the electronic device. A method for making is also disclosed.

REFERENCES:
patent: 4924080 (1990-05-01), Caserta et al.

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