Method and apparatus for plasma treatment of a filament

Coating processes – Direct application of electrical – magnetic – wave – or... – Polymerization of coating utilizing direct application of...

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427 2, 427491, 427535, 427538, 427539, 427569, 427237, 427238, B05D 306, B05D 722, A01N 102

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052543722

ABSTRACT:
A method for plasma treatment of a predetermined portion of a substrate. The impedance of the coil and an established normal plasma is matched with the impedance of a power source, thereby maximizing the efficiency of the transfer of energy from the power source to the coil and producing a resonant plasma. The predetermined portion of the substrate is exposed to the resonant plasma for treatment. Additionally, a method for plasma treatment of a predetermined portion of the outside surface of a filament. The filament is trained through an inlet and exit of a plasma treatment chamber, through an inlet side tubular mask within the chamber, and through an exit side tubular mask within the chamber, each mask being adjustable within the chamber axially of the filament to expose a predetermined segment of the filament to plasma in the chamber while masking the remainder of the filament within the chamber from exposure to plasma. The predetermined segment is subjected to plasma treatment by establishing a plasma within the chamber which contacts the filament. Additionally, an apparatus adapted for carrying out the foregoing methods and a dielectric catheter produced by the foregoing methods.

REFERENCES:
patent: 3313269 (1967-04-01), Hough
patent: 3365330 (1968-01-01), Hough
patent: 3409469 (1968-11-01), Kuntz
patent: 3572286 (1971-03-01), Forney
patent: 3738314 (1973-06-01), Morelock
patent: 3780255 (1973-12-01), Boom
patent: 3865074 (1975-02-01), Cornelissen et al.
patent: 3892892 (1975-07-01), Hofer
patent: 3895135 (1975-07-01), Hofer
patent: 4072769 (1978-02-01), Lidel
patent: 4123308 (1978-10-01), Nowlin et al.
patent: 4188426 (1980-02-01), Auerbach
patent: 4266999 (1981-05-01), Baier
patent: 4366184 (1982-12-01), Auerbach et al.
patent: 4421843 (1983-12-01), Hattori et al.
patent: 4551778 (1985-11-01), Arai et al.
patent: 4568563 (1986-02-01), Jackson et al.
patent: 4632842 (1986-12-01), Karwoski et al.
patent: 4656083 (1987-04-01), Hoffman et al.
patent: 4673589 (1987-06-01), Standley
patent: 4692347 (1987-09-01), Yasuda
patent: 4693927 (1987-09-01), Nishikawa et al.
patent: 4718907 (1988-01-01), Karwoski et al.
patent: 4921723 (1990-05-01), Nichols et al.
patent: 4948628 (1990-08-01), Montgomery et al.
patent: 5034265 (1991-07-01), Hoffman et al.
Nichols et al., "The Effect of High Energy `Electrodeless` Plasma Polymerized Methane Polymers on the Adhesion Characteristics of Poly-p-xylylene films," J. Adhes. Sci. Tech. vol. 2, No. 1 (1988) Feb.
Sharma and Yasuda, "Effect of Glow Discharge Treatment of Substrates on Parylene-substrate Adhesion," J. Vac. Sci. Tech. 21(4) Nov./Dec. 1982.
Sharma and Yasuda, "Effect of Surface Energetics of Substrates on Adhesion Characteristics of Poly-p-xylylenes," J. Adhesion, 13, 201 (1982) no month.

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