Method and apparatus for plasma optimization in water...

Coating apparatus – Gas or vapor deposition – With treating means

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C118S7230MW, C156S345350, C156S345360

Reexamination Certificate

active

07017514

ABSTRACT:
An apparatus for managing plasma in wafer processing operations is disclosed which includes a housing having an internal region defined by an inner wall. The housing has an input port for supplying a plasma into the housing at a first end and an output port at a second end. The apparatus includes a hollow tube contained in the internal region within the housing. The hollow tube is defined by a wall that extends between the first end and the second end and contains a plurality of orifices generating a plurality of fluid paths through the wall. A fluid input is included supplying fluid into the internal region of the housing. The supplied fluid is capable of passing through the plurality of orifices, and the plasma supplied through the input port is capable of being mixed within the hollow tube with the supplied fluid. The output port at the second end of the housing enables the mixed plasma and fluid supply to exit the housing.

REFERENCES:
patent: 2245145 (1941-06-01), Hall et al.
patent: 4311671 (1982-01-01), Notman
patent: 4508054 (1985-04-01), Baumberger et al.
patent: 4761269 (1988-08-01), Conger et al.
patent: 4951603 (1990-08-01), Yoshino et al.
patent: 4979465 (1990-12-01), Yoshino et al.
patent: 5252131 (1993-10-01), Kiyama et al.
patent: 5354412 (1994-10-01), Suzuki et al.
patent: 5399199 (1995-03-01), Kiyama et al.
patent: 5480678 (1996-01-01), Rudolph et al.
patent: 5814154 (1998-09-01), Boitnott
patent: 6007671 (1999-12-01), Fujimura et al.
patent: 6098965 (2000-08-01), Jacobs et al.
patent: 6123775 (2000-09-01), Hao et al.
patent: 6161500 (2000-12-01), Kopacz et al.
patent: 6245192 (2001-06-01), Dhindsa et al.
patent: 6245396 (2001-06-01), Nogami
patent: 6432831 (2002-08-01), Dhindsa et al.
patent: 6521858 (2003-02-01), Barnett
The Handbook of Fluid Dynamics—“Basic Engineering Fluid Mechanics”, p. 5-62, Foss et al; 1998 CRC Press.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method and apparatus for plasma optimization in water... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and apparatus for plasma optimization in water..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for plasma optimization in water... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3577630

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.