Method and apparatus for planarizing microelectronic substrates

Details Method and apparatus for planarizing microelectronic substrates Method and apparatus for planarizing microelectronic substrates

1997-12-22

2000-07-04

Eley, Timothy V.

Abrading

Abrading process

With tool treating or forming

451 72, 451910, B24B 100, B24B 700

Patent

active

060830859

ABSTRACT:
A method and apparatus for mechanical and/or chemical-mechanical planarization of microelectronic substrates. In one embodiment, a conditioning device for removing waste matter from a microelectronic planarizing medium has a support assembly with a support member and a conditioning head attached to the support member. The support member may be a pivoting arm or gantry assembly that carries the condition head over the planarizing medium. The conditioning head may have a non-contact conditioning element that transmits a form of non-contact energy to waste matter on the planarizing medium. The non-contact conditioning element, for example, may be an emitter that transmits a selected waveform capable of penetrating the planarizing medium and the waste matter on the planarizing medium. In operation, the selected non-contact energy may impart energy to the waste matter that weakens or breaks bonds in the waste matter and/or bonds between the planarizing medium and the waste matter.

REFERENCES:
patent: 1738565 (1929-12-01), Claypoole
patent: 2163650 (1939-06-01), Weaver
patent: 2468550 (1949-04-01), Fruth
patent: 2647846 (1953-08-01), Bagno
patent: 2702692 (1955-02-01), Kessler
patent: 5478270 (1995-12-01), Cuomo et al.
patent: 5522965 (1996-06-01), Chisholm et al.
patent: 5868608 (1999-02-01), Allman et al.

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