Abrading – Machine – Reciprocating tool
Reexamination Certificate
2006-02-14
2006-02-14
Rachuba, M. (Department: 3723)
Abrading
Machine
Reciprocating tool
C451S173000, C451S451000
Reexamination Certificate
active
06997789
ABSTRACT:
A method and apparatus for planarizing a microelectronic substrate. In one embodiment, the apparatus can include an elongated, non-continuous polishing pad oriented at an angle relative to the horizontal to allow planarizing liquids and materials removed from the microelectronic substrate to flow off the polishing pad under the force of gravity. Two such polishing pads can be positioned opposite each other in a vertical orientation and can share either a common platen or a common substrate carrier. The polishing pads can be pre-attached to both a supply roll and a take-up roll to form a cartridge which can be easily removed from the apparatus and replaced with another cartridge.
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Dorsey & Whitney LLP
Micro)n Technology, Inc.
Rachuba M.
LandOfFree
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