Method and apparatus for placing plies on curved substrates

Details Method and apparatus for placing plies on curved substrates Method and apparatus for placing plies on curved substrates

2011-08-09

2011-08-09

Yao, Sam C (Department: 1746)

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

C156S361000, C156S577000, C156S185000

Reexamination Certificate

active

07993480

ABSTRACT:
A ply placement device uses a ply guide to place plies on a curved substrate surface. The ply guide includes a guide surface and a guide edge that are each curved to match the contour of the substrate so that the ply transitions smoothly from its planar form to a curved form as the ply is placed onto the substrate. The ply guide may be flexible or segmented to allow reconfiguration of the guide surfaces to match various substrate contours.

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