Method and apparatus for placing conductive preforms

Details Method and apparatus for placing conductive preforms Method and apparatus for placing conductive preforms

1997-01-28

1999-12-14

Ryan, Patrick

Metal fusion bonding

Process

Preplacing solid filler

228 41, B23K 3102, B23K 100

Patent

active

060006021

ABSTRACT:
A method and apparatus are disclosed for placing solder balls 201 on electronic pads 1204 on a substrate 1202, such as for a ball grid array (BGA) applicator 10. The solder balls 201 are held to openings 102 in a foil 22 such as by vacuum force 1607 applied to the solder balls 201 through the openings 102 in a foil 22. After locating the solder balls 201 at electronic pads 1204 on a substrate 1202, by deactivating the vacuum force 1607 and optionally applying a release force 1703 the solder balls 201 are released and placed on the electronic pads 1204. Optionally, a release mechanism 2400 applies placing force 2600 to the solder balls 201 through the openings 2404 in the foil 2403.

REFERENCES:
patent: 4871110 (1989-10-01), Fukasawa et al.
patent: 5088639 (1992-02-01), Condotra et al.
patent: 5107759 (1992-04-01), Omori
patent: 5255839 (1993-10-01), Da Costa Alves et al.
patent: 5392980 (1995-02-01), Swamy
patent: 5431332 (1995-07-01), Ito
patent: 5540377 (1996-07-01), Kirby
patent: 5542601 (1996-08-01), Fallon
patent: 5685477 (1997-11-01), Mallik et al.

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