Method and apparatus for placing conductive balls

Details Method and apparatus for placing conductive balls Method and apparatus for placing conductive balls

2008-08-25

2009-11-10

Ward, Jessica L. (Department: 1793)

Metal fusion bonding

Process

Preplacing solid filler

C228S245000, C228S041000

Reexamination Certificate

active

07614541

ABSTRACT:
An improved placing method and placing apparatus are provided for placing conductive balls in a predetermined pattern onto a base unit. In the placing method for placing balls having conductivity in a predetermined pattern onto one surface of the base unit, an arrangement member has one surface, another surface opposite to the one surface of the arrangement member and positioning openings, wherein the positioning openings are arranged corresponding to the pattern such that the openings are through from the one surface to the another surfaces of the arrangement member so that the balls are inserted therein. The another surface of the arrangement member is positioned opposite to the one surface of the base unit. The arrangement member has two or more line members of which the core axes are substantially aligned. The transfer device is arranged in a manner that the line members are substantially in a horizontal position to contact with the balls supplied to one surface of the arrangement member, and then the transfer device is horizontally moved with respect to the one surface of the arrangement member. Then, the balls are placed on the one surface of the base unit through the positioning openings.

REFERENCES:
patent: 5261593 (1993-11-01), Casson et al.
patent: 6213386 (2001-04-01), Inoue et al.
patent: 6460755 (2002-10-01), Inoue et al.
patent: 03241756 (1991-10-01), None

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