Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Reexamination Certificate
2004-03-08
2008-10-07
Tucker, Philip C (Department: 1791)
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
C228S245000, C228S246000
Reexamination Certificate
active
07431792
ABSTRACT:
Improved placing method and apparatus are provided for placing conductive balls in a predetermined pattern onto one surface of a base unit. An arrangement member is provided to have one surface, another surface opposite to the one surface of the arrangement member and positioning openings The positioning openings are arranged corresponding to the pattern so that the balls are inserted therein. The another surface of the arrangement member is opposite to the one surface of the base unit. The arrangement member has two or more line members whose core axes are substantially aligned. The transfer device is arranged so that the line members are substantially in a horizontal position to contact with the balls, and then the transfer device is horizontally moved with respect to the one surface of the arrangement member. Then, the balls are placed on the one surface of the base unit through the positioning openings.
REFERENCES:
patent: 3665856 (1972-05-01), Heller, Jr.
patent: 4441228 (1984-04-01), Marquart et al.
patent: 6213386 (2001-04-01), Inoue et al.
patent: 6622773 (2003-09-01), Farnworth
patent: 2003/0127501 (2003-07-01), Cheng et al.
patent: 2003/0201309 (2003-10-01), Grigg et al.
patent: 07-156363 (1995-06-01), None
patent: 08-236916 (1996-09-01), None
patent: 09-162533 (1997-06-01), None
patent: 09-293753 (1997-11-01), None
patent: 10-126046 (1998-05-01), None
patent: 11-243274 (1999-09-01), None
patent: 2000-049183 (2000-02-01), None
patent: 2001-118496 (2001-04-01), None
patent: 2001-223234 (2001-08-01), None
patent: 2001-244288 (2001-09-01), None
patent: 2001-267731 (2001-09-01), None
patent: 2002-151539 (2002-05-01), None
patent: 2002-171054 (2002-06-01), None
Itoh Motoyuki
Kazui Shinichi
Ochiai Masanori
Hitachi Metals Ltd.
J.C. Patents
McClelland Kimberly K
Tucker Philip C
LandOfFree
Method and apparatus for placing conductive balls does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method and apparatus for placing conductive balls, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for placing conductive balls will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4006494