Metal fusion bonding – Process – Preplacing solid filler
Patent
1998-02-18
2000-09-19
Ryan, Patrick
Metal fusion bonding
Process
Preplacing solid filler
228 54, 228202, 228219, 228220, 228221, 228222, 228246, B23K 3512, B23K 302, B23K 2800, B23K 3102, B23K 3538
Patent
active
061199273
ABSTRACT:
A method and apparatus for placing and attaching solder balls to a substrate having conductive pads in a predetermined pattern is disclosed. The substrate is placed on a carrier plate. An alignment plate having holes corresponding to the predetermined pattern is mated to the carrier plate with its holes aligned with the predetermine pattern on the substrate. Solder balls are loaded into each hole of the alignment plate. The solder balls may be loaded with a vacuum plate which uses vacuum to pick up solder balls in the predetermined pattern and place them over the holes on the alignment plate. The vacuum is released for dropping the balls in the holes of the alignment plate. Alternatively a shutter plate having holes corresponding to the holes on the alignment plate is fitted on the alignment plate and afforded slidable movement between an offset position and an aligned position. A ball is loaded in each hole in the shutter plate when it is in its offset position. The shutter plate is then slid its aligned position wherein its holes are aligned with the holes on the alignment plate causing the balls to drop into the holes on the alignment plate and onto a conductive pad of the substrate. The assembly of carrier and alignment plate is then heated in a non-oxidizing atmosphere in a furnace causing the solder balls to reflow and attach to the pads on the substrate.
REFERENCES:
patent: 3719981 (1973-03-01), Steitz
patent: 4460108 (1984-07-01), Noda et al.
patent: 5118027 (1992-06-01), Braun et al.
patent: 5219117 (1993-06-01), Lin
patent: 5279045 (1994-01-01), Odashima et al.
patent: 5324569 (1994-06-01), Nagesh et al.
patent: 5356838 (1994-10-01), Kim
patent: 5431332 (1995-07-01), Kirby et al.
patent: 5499487 (1996-03-01), McGill
patent: 5551627 (1996-09-01), Leicht et al.
patent: 5601229 (1997-02-01), Nakazato et al.
patent: 5685477 (1997-11-01), Mallik et al.
patent: 5735452 (1998-04-01), Yu et al.
Scientific Sealing Technology, Downey, California, "Enhanced Vacuum Process Furnace Model MV-2200" brochure, 2pp.
Alpha Metals, Inc., Jersey City, New Jersey, "Coplanarity Issues for Ball Grid Arrays as Affected by Solder Spheres/Bumping," Application Bulletin SM-473-1, 2pp.
Alpha Metals, Inc., Jersey City, New Jersey, "Aqualine.TM. WS609 BGAFLUX," Technical Bulletin SM-480, 2pp.
Alpha Metals, Inc., Jersey City, New Jersey, "Aqualine.TM. WS613 BGFLUX," Technical Bulletin SM-481, 2pp.
Alpha Metals, Inc., Jersey City, New Jersey, "Guideline.TM. RMA376EH BGAFLUX," Technical Bulletin SM-482, 2pp.
Alpha Metals, Inc., Jersey City, New Jersey, "Cleanline.TM. LR735 BGAFLUX," Technical Bulletin SM-483, 2pp.
Alpha Metals, Inc., Jersey City, New Jersey, "Solder Spheres Technical Data," Technical Bulletin SM-485, 2pp.
Alpha Metals, Inc., Jersey City, New Jersey, "Solder Sphere Quality Assurance," Technical Bulletin SM-486, 2pp.
Alpha Metals, Inc., Jersey City, New Jersey, "ESD Solder Sphere Packaging," Technical Bulletin SM-487, 2pp.
Alpha Metals, Inc., Jersey City, New Jersey, "Solder Sphere Oxidation," Application Bulletin SM-488, 1pp.
Alpha Metals, Inc., Jersey City, New Jersey, "Bumping BGA Packages: Solder Sphere/Paste Reflow," Application Bulletin SM-489, 2pp.
Alpha Metals, Inc., Jersey City, New Jersey, "BGA Package Solder Bump Quality," Application Bulletin SM-490, 2pp.
Bulwith et al., "Solder Sphere Concerns in Grid Array Bumping," Alpha Metals, Inc., Jersey City, New Jersey, 8pp.
Denlinger et al., "Reliable and Economical Assembly of Hybrid Microelectronic Packages," Scientific Sealing Technology, Downey, California, 6pp.
Rooks, "Controlling BGA Assembly Using X-Ray Laminography," Electronic Packaging & Production, Jan. 1997, pp. 24-31.
Scientific Sealing Technology, Downey, California, "Hermetic Package Sealing and Assembly Model DAP 2200" brochure, 4pp.
Barnes Paul W.
Ramos Richard
EDM Supplies, Inc.
Pittman Zidia J.
Ryan Patrick
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