Method and apparatus for placing a hook-up wire on a mounting bo

Details Method and apparatus for placing a hook-up wire on a mounting bo Method and apparatus for placing a hook-up wire on a mounting bo

1985-03-06

1986-11-04

Gallagher, John J.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

29745, 29829, 156320, 1563244, 156433, 156543, 156579, 219 5622, 219229, 219237, 219238, 228 51, 228 55, 269903, B32B 3112

Patent

active

046208895

ABSTRACT:
Previously, hook-up wires were glued to a mounting board by means of spot gluing. As disclosed herein, the insulated hook-up wire is first continuously coated with a coating of hot-melt adhesive and is then placed on the mounting board and simultaneously bonded by means of a heated laying tip of an application tool, similar to a soldering bit. When passing through the laying tip, the hook-up wire is briefly heated, whereby the coating of hot-melt adhesive is melted. The insulating layer of the hook-up wire has a higher temperature stability and is thereby not altered. In the immediately following application of the hook-up wire to the mounting board, the hot-melt adhesive cools and connects the hook-up wire to the mounting board.

REFERENCES:
patent: 3627192 (1971-12-01), Killingsworth
patent: 3639193 (1972-02-01), Hawkins

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