Method and apparatus for picking up semiconductor chip and...

Details Method and apparatus for picking up semiconductor chip and... Method and apparatus for picking up semiconductor chip and...

2003-07-15

2009-12-15

Osele, Mark A (Department: 1791)

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With microwave gas energizing means

C156S583200, C438S464000, C438S976000

Reexamination Certificate

active

07632374

ABSTRACT:
In an adhesive sheet exfoliation process in a pick-up operation for a thin-type chip6adhered to the adhesive sheet5,a suction exfoliation tool22provided at its adhesion surface22awith plural suction grooves22bis abutted against the lower surface of the adhesive sheet5. Then, air within the suction grooves22bare vacuum-sucked to bend and deform the adhesive sheet5together with the chip6thereby to exfoliate the adhesive sheet5from the lower surface of the chip6due to such bending deformation. Thus, it is possible to realize the picking-up operation with high productivity without causing a problem such as breakage or crack.

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