Method and apparatus for physical vapor deposition of thin films

Coating apparatus – Control means responsive to a randomly occurring sensed... – Sampling of associated base

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118690, 118708, 118715, 118725, 118726, 118730, 219 72, 219209, 156345, C23C 1600

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048585564

ABSTRACT:
A physical vapor deposition system is disclosed for routinely achieving unprecedented processing uniformity of thin films on substrates of a size comparable to or larger than the source. The system includes a plurality of substrates; a plurality of deposition, etching, and/or heating sources; a plurality of mobile in-situ process monitors for obtaining the fundamental processing profiles that characterize the processing properties of each source; and mobile fixturing responsive to the fundamental processing profiles for effecting prescribed motion scenarios of the substrate relative to the source; to thus provide the means for achieving extremely uniform as well as an unprecedented range of prescribed non-uniform final thin film processing profiles, irrespective of the size of the substrate relative to the size of the source.

REFERENCES:
patent: 4100879 (1978-07-01), Goldin
patent: 4121537 (1978-10-01), Maruyama
patent: 4207836 (1980-06-01), Nonaka
patent: 4403567 (1983-09-01), daCosta
patent: 4515204 (1985-05-01), Ohno

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