Method and apparatus for personalization of semiconductor

Details Method and apparatus for personalization of semiconductor Method and apparatus for personalization of semiconductor

2007-10-31

2010-11-30

Nguyen, Thinh T (Department: 2818)

Semiconductor device manufacturing: process

Making device or circuit emissive of nonelectrical signal

Packaging or treatment of packaged semiconductor

C438S377000, C438S015000, C359S027000, C359S237000

Reexamination Certificate

active

07842525

ABSTRACT:
A system for making small modifications to the pattern in standard processed semiconductor devices. The modifications are made to create a small variable part of the pattern against a large constant part of the same pattern. In a preferred embodiment the exposure of the variable and constant parts are done with the same wavelength in the same combined stepper and code-writer. The invention devices a way of writing variable parts of the chip that is automatic, inexpensive and risk-free. A system for automatic design and production of die-unique patterns is also shown.

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Translation of Japanese Office Action dated Aug. 13, 2010.

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