Metal fusion bonding – Process – Plural joints
Patent
1993-12-20
1995-03-07
Heinrich, Samuel M.
Metal fusion bonding
Process
Plural joints
228219, H01L 2160, B23K 3538
Patent
active
053950372
ABSTRACT:
A method for bonding a solder wire is provided wherein a lower ball end of a material solder wire is first bonded to a first bonding portion of a workpiece. Then, the material solder wire is thermally cut to provide a solder wire segment held bonded to the first bonding portion and having an upper ball end. Finally, the upper ball end is bonded to a second bonding portion of the workpiece. All of the wire bonding process steps are performed in an oxygen-free atmosphere to prevent oxidation of the solder wire.
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patent: 4705204 (1987-11-01), Hirota et al.
patent: 4814855 (1989-03-01), Hodgson et al.
patent: 4889274 (1989-12-01), Ramsey
patent: 5295619 (1994-03-01), Takahashi et al.
Fujino Shin-ichi
Hirano Tomoyasu
Sakamoto Kazuhiro
Takahashi Hiroyuki
Eilberg William H.
Heinrich Samuel M.
Rohm & Co., Ltd.
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