Electric heating – Heating devices – Combined with container – enclosure – or support for material...
Patent
1996-09-17
2000-08-01
Pelham, Joseph
Electric heating
Heating devices
Combined with container, enclosure, or support for material...
219411, 118 501, 118730, C23C 1606, B05D 306, F27B 510, F27B 916
Patent
active
060969989
ABSTRACT:
A thermal reflow processing system has a rotatable structure to which articles having a reflowable surface are attached. The structure is coupled to a drive motor which causes the structure to rotate at speeds which generate centripetal forces in excess of that of gravity. The system is equipped with at least one radiant heat source. As the articles are being subjected to a centripetal force, the surface is heated by the radiant heat source. In a preferred embodiment, the structure is a hermetically-sealable chamber which can be pressurized or evacuated. The articles, which may be semiconductor wafers, are positioned on the rotating structure such that the surface to be reflowed faces both the heat source and the structure's rotational axis. In the case of circular semiconductor wafers, the wafers are positioned such that the planar surface of each wafer is centered on and perpendicular to a radius of the cylindrical chamber. By performing the reflow operation while the chamber is spinning, high pseudo-gravitational forces can be generated which aid in planarization, void elimination, densification and in the filling of small aspect ratio contact via openings.
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Chapek David L.
Robinson Karl M.
Britt Trask
Micro)n Technology, Inc.
Pelham Joseph
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