Method and apparatus for performing testing of double-sided ball

Details Method and apparatus for performing testing of double-sided ball Method and apparatus for performing testing of double-sided ball

1996-11-12

2000-02-01

Nguyen, Vinh P.

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

324765, G01R 3102

Patent

active

060207493

ABSTRACT:
A system and method of constructing and using a test module in situations where internal access to test points on a substrate are unavailable because devices mounted on the substrate block physical access. The test module is itself a solderable substrate and is imposed, for testing purposes, between the main substrate and the mounted devices. For double-sided or stacked main boards, two or more such modules can be used interposed between the mounted devices and the main substrate. Vias in the module serve to make contact with the test points and to carry the signals to the edge of the module where cups can be formed by cutting the edge vias in half.

REFERENCES:
patent: 5315241 (1994-05-01), Ewers
patent: 5500605 (1996-03-01), Chang
patent: 5672965 (1997-09-01), Kurafuchi et al.
patent: 5716222 (1998-02-01), Murphy
patent: 5731709 (1998-03-01), Pasore et al.
"Customable Multi-Contact-Point Interposer", IBM Technical Disclosure Bulletin, vol. 37, No. 4B, Apr. 1, 1994, pp. 105/106, XP 000451189.

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