Method and apparatus for performing microelectronic bonding usin

Details Method and apparatus for performing microelectronic bonding usin Method and apparatus for performing microelectronic bonding usin

1995-05-05

1997-03-25

Evans, Geoffrey S.

Electric heating

Metal heating

By arc

21912163, B23K 2600

Patent

active

056141130

ABSTRACT:
The method and apparatus utilize a laser to heat bond pads. While the bond pads are hot, a wire is bonded to the bond pad. The method and apparatus of the present invention may also be used to heat a lead finger of an integrated circuit lead frame using a laser and to bond a wire to the lead finger while the lead finger is hot.

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patent: 4926022 (1990-05-01), Freedman
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patent: 5298715 (1994-03-01), Chalco et al.
patent: 5452841 (1995-09-01), Sibata et al.
"Discrete Wire Bonding Using Laser Energy," P. Chalco, A. Gupta, B. Hussey, R. Hodgson and G. Arjavalingam, Semiconductor International, May 1988, pp. 130-131.
"Intrinsic Thermocouple Monitor for Laser Wirebonding," Brian Hussey, Gnanalingam Arjavalingam, Arunava Gupta, Pedro A. Chalco and H. Tong, IEEE Transactions on Components, Packaging and Manufacturing Technology, Part A., vol. 18. No. 1, Mar. 1995, pp. 206-214.

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