Method and apparatus for performing deep UV photolithography

Radiant energy – Irradiation of objects or material – Irradiation of semiconductor devices

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250504R, 315248, 430311, H01J 6504

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active

045324271

ABSTRACT:
A method and apparatus for performing deep UV photolithography which utilizes a microwave generated electrodeless light source for producing deep UV radiation. This results in faster semiconductor exposure times and less system downtime for changing failed bulbs as well as other advantages which are detailed herein.

REFERENCES:
patent: 3518083 (1970-06-01), Touchy
patent: 3596083 (1971-07-01), Lovering
patent: 3695758 (1972-10-01), Tanaka
patent: 3860335 (1975-01-01), Caprari
patent: 3872349 (1975-03-01), Spero et al.
patent: 3943403 (1976-03-01), Haugsjaa et al.
patent: 3993927 (1976-11-01), Haugsjaa et al.
patent: 4041352 (1977-08-01), McNeill et al.
patent: 4042850 (1977-08-01), Ury et al.
patent: 4215935 (1980-08-01), Loebach
patent: 4485332 (1984-11-01), Ury et al.
"Optical Lithography in the 1-.mu.m Limit" by Daryl Ann Doane, Solid State Technology, Aug. 1980, pp. 101-114.
"A Practical Multilayer Resist Process for 1 .mu.m Lines" by Batchelder et al, Semiconductor International, Apr. 1981, pp. 214-218.
"Deep UV Lithography" by Burn Jeng Lin, Vac. Sci. Technol., vol. 12, No. 6, Nov./Dec. 1975, pp. 1317-1320.
"A Novel Exposure System for High-Resolution Deep UV Lithograpy" by F. Caprari and D. A. Doane.
Fusion Systems information packet.

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