Electric heating – Heating devices – Combined with container – enclosure – or support for material...
Reexamination Certificate
2005-01-04
2005-01-04
Fuqua, Shawntina (Department: 3742)
Electric heating
Heating devices
Combined with container, enclosure, or support for material...
C219S405000, C219S411000, C392S416000, C392S418000, C118S724000, C118S725000, C118S501000
Reexamination Certificate
active
06838643
ABSTRACT:
An apparatus for baking a semiconductor wafer having a resist pattern thereon includes a baking oven in which the semiconductor wafer is placed and heated, and a first hot plate which is provided in the baking oven to heat an entire bottom surface of the semiconductor wafer. The apparatus also includes a gas supply unit having a gas introducing path, through which the purge gas is introduced into the baking oven, and a gas exhaust path, through which the purge gas is exhausted out of the baking oven. A gas temperature controller controls a temperature of the purge gas in order that the purge gas flowing around a peripheral edge or outer portion of the wafer has a higher temperature than that around the center or inner portion of the wafer.
REFERENCES:
patent: 6033474 (2000-03-01), Mita et al.
patent: 6402844 (2002-06-01), Harada et al.
patent: 11-204402 (1999-07-01), None
Furukawa Takamitsu
Kobayashi Shouzou
Muto Koki
Nishimuro Tadashi
Oshima Katsuo
OKI Electric Industry Co., Ltd.
Rabin & Berdo PC
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