Method and apparatus for performing a double shift print on a su

Photocopying – Projection printing and copying cameras – Step and repeat

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356399, 250458, 355 67, 355 71, G03B 2742, F21V 916, G01B 1100

Patent

active

061633682

ABSTRACT:
A method and apparatus for printing a feature having a reduced critical dimension on a photoresist-coated semiconductor wafer are disclosed. The method comprises the steps of positioning the wafer relative to the reticle at a first shifted position, exposing a first region of the wafer to radiant energy through a pattern transfer tool to define a first side of the feature, positioning the wafer relative to the pattern transfer tool at a second shifted position, and exposing a second region of the wafer to radiant energy through the pattern transfer tool to define a second side of the feature.

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"The Ultimate Lithography Solution For 0.5 .mu.m to 0.25 .mu.m", 4 pages, 1992.

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