Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1986-02-27
1988-05-03
Weston, Caleb
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
156228, 156245, 156292, 1563031, 1563073, 156378, 156382, 156499, 156500, 295691, 26427217, B29C 4318
Patent
active
047417870
ABSTRACT:
The present invention relates to a method of and an apparatus for packaging a semiconductor device and the like to package the semiconductor device and the like completely associated with resin.
A process for packaging a semiconductor device and the like according to the present invention comprises the steps of providing a tablet of thermoplastic resin such as epoxy resin, weighing the tablet for upper and lower packages, preheating the upper and lower packages, then compression molding the packages in a package shape, coating the opposed surfaces to be bonded of the upper and lower packages with a fusible bonding agent such as thermoplastic resin and/or bonding agent, then interposing a chip of a semiconductor device and the like between the upper package and the lower package, heating the upper and lower packages while supplying nitrogen gas in a vacuum molding machine, bonding the upper and lower packages, and conducting an antioxidation of a metal portion.
REFERENCES:
patent: 4480975 (1984-11-01), Plummer et al.
Narisawa Saburo
Shimizu Katsuo
Seiei Kohsan Co., Ltd.
Weston Caleb
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