Method and apparatus for packaging electronic components with th

Details Method and apparatus for packaging electronic components with th Method and apparatus for packaging electronic components with th

1974-03-13

1976-08-03

Husar, Francis S.

Plastic article or earthenware shaping or treating: apparatus

Distinct means to feed, support or manipulate preform stock...

Female mold type means

29588, 425129R, 425250, B29F 110

Patent

active

039726630

ABSTRACT:
A method and apparatus for packaging electronic components such as for example pulse transformers or the like with a thermosetting material such as for example a phenolic or epoxy resin. A pulse transformer element comprising a toroidal ferrite core having coils wound thereon embedded in a thermosetting base member provided with an intermediate flange-like portion, and terminal pins, is inserted in a lower mold cavity formed in a mold magazine, with the terminal pins inserted in elongated slots formed in the bottom surface of the lower mold cavity which is isolated by the pulse transformer element per se from the upper mold cavity into which the thermosetting material is injected. The aforementioned flange-like portion of the pulse transformer element has its top surface raised slightly above that of the lower mold and its periphery engaged with the upper mold, and it is softened by the heat of the molds, thus producing a sealing effect between the upper and lower mold cavities, whereby flash is caused to occur neither between the molds nor at the terminal pins of the packaged product.

REFERENCES:
patent: 29, None
patent: 2465799 (1949-03-01), Gravesen
patent: 3091809 (1963-06-01), Trueblood
patent: 3315309 (1967-04-01), Braun
patent: 3357058 (1967-12-01), Kutik
patent: 3449641 (1969-06-01), Lee
patent: 3493908 (1970-02-01), Byers et al.
patent: 3568247 (1971-03-01), Lunn
patent: 3712575 (1973-01-01), Bement et al.

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