Method and apparatus for packaging circuit devices

Details Method and apparatus for packaging circuit devices Method and apparatus for packaging circuit devices

2011-07-12

2011-07-12

Sarkar, Asok K (Department: 2891)

Semiconductor device manufacturing: process

Bonding of plural semiconductor substrates

Having enclosed cavity

C257SE21577, C438S667000, C438S672000

Reexamination Certificate

active

07977208

ABSTRACT:
A hermetically sealed package includes a lid (14) hermetically bonded to a wafer or substrate (12), with a chamber therebetween defined by a recess (16) in the lid. A circuit device (26) such as MEMS device is provided within the chamber on the substrate. A plurality of vias (41-46) are provided through the substrate, and each have a structure which facilitates a hermetic seal of a suitable level between opposite sides of the substrate. The vias provide electrical communication from externally of the assembly to the device disposed in the chamber.

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