Package making – Methods – Filling preformed receptacle and closing
Patent
1997-11-05
1999-03-23
Coan, James F.
Package making
Methods
Filling preformed receptacle and closing
53390, 53476, 53477, 206461, 206462, B65B 500, B65B 700
Patent
active
058844562
ABSTRACT:
A method and apparatus for assembling a blister package. The apparatus includes a packaging jig having a plurality of perimeter locating pins that are arranged to extend around the perimeter of the package when assembled on the jig. In a first aspect, the jig also includes an interior locating pin positioned inwardly from the perimeter locating pins to register a blister and possibly an article during assembly. In a second aspect of the invention, the jig further includes a plurality of exterior locating pins positioned outwardly from the perimeter locating pins to register an article to be packaged during assembly. The blister package is assembled by sequentially positioning the display cards, blister, and article on the jig such that the locating pins register the various components. The display cards are positioned within the perimeter locating pins, the blister is positioned between the perimeter locating pins and the interior locating pin, and the article is positioned between the interior locating pin and the exterior locating pins. Once positioned on the jig, the components are interconnected using conventional methods and apparatus.
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Coan James F.
Display Pack, Inc.
Kim Gene L.
LandOfFree
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