Radiation imagery chemistry: process – composition – or product th – Electric or magnetic imagery – e.g. – xerography,... – Persistent internal polarization imaging
Patent
1997-01-21
1998-02-03
Picardat, Kevin
Radiation imagery chemistry: process, composition, or product th
Electric or magnetic imagery, e.g., xerography,...
Persistent internal polarization imaging
437 50, 437 55, H01L 2160
Patent
active
057144095
ABSTRACT:
An apparatus for packaging a vehicle sensor and integrated circuit chip includes a ceramic substrate having an opening formed therein. A sensor is secured within the opening. An integrated circuit chip is secured within the opening in electrical communication with the sensor. A pair of electrical connectors are secured on the ceramic substrate in electrical communication with the integrated circuit chip. A metal lid is secured over the opening on the ceramic housing to enclose the integrated circuit chip and sensor. A molded plastic coating encloses the ceramic housing and metal lid, and the electrical connectors extend from the plastic coating. The sensor may be a pressure sensor or acceleration sensor.
REFERENCES:
patent: 3417361 (1968-12-01), Heller et al.
patent: 4850227 (1989-07-01), Luettgen et al.
patent: 5377524 (1995-01-01), Wise et al.
patent: 5399903 (1995-03-01), Rostoker et al.
patent: 5424249 (1995-06-01), Ishibashi
patent: 5495414 (1996-02-01), Spangler et al.
patent: 5525834 (1996-06-01), Fischer et al.
patent: 5532187 (1996-07-01), Schreiber-Prillwitz et al.
Abolins Peter
Ford Motor Company
May Roger L.
Picardat Kevin
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