Method and apparatus for packaging a microelectronic device with

Details Method and apparatus for packaging a microelectronic device with Method and apparatus for packaging a microelectronic device with

1997-12-18

1999-05-18

Sparks, Donald

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

174117A, 174 524, 361767, 361771, 361820, 439 66, H05K7/10;7/12

Patent

active

059056380

ABSTRACT:
An apparatus and method for packaging a microelectronic device to be connectable to a distribution circuit. The apparatus is in the form of a microelectronic package including a microelectronic device having first and second oppositely facing surfaces and a plurality of Input/Output pads on the first surface capable of being electrically interconnected to a distribution circuit, a base adapted to support the microelectronic device in a predetermined operative relationship to a distribution circuit, and a first layer of elastomer gel sandwiched between the first surface and the base. The first surface of the microelectronic device overlays the base so as to allow an electrical interconnection through the base between the microelectronic device and a distribution circuit.

REFERENCES:
patent: 4008300 (1977-02-01), Ponn
patent: 4770641 (1988-09-01), Rowlette
patent: 5074799 (1991-12-01), Rowlette, Sr.
patent: 5424652 (1995-06-01), Hembree et al.

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