Method and apparatus for oxidizing conductive redeposition...

Details Method and apparatus for oxidizing conductive redeposition... Method and apparatus for oxidizing conductive redeposition...

2006-12-12

2006-12-12

Huynh, Andy (Department: 2818)

Semiconductor device manufacturing: process

Having magnetic or ferroelectric component

C438S004000, C438S063000

Reexamination Certificate

active

07148072

ABSTRACT:
A method and apparatus for oxidizing conductive redeposition in TMR sensors is disclosed. A TMR barrier layer is etched. Redeposition material is oxidized and the barrier is healed using an oxidizing agent selected from the group consisting of ozone and water vapor.

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Takeshi Hattori, “Implementing a single-wafer cleaning technology suitable for minifab operations,” Micromagazine.com, 13 pages.

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